Breaking Barriers in Data Communication: ULVAC & SAL join forces
Chigasaki, Japan, Dec 9, 2024 – (JCN Newswire via SeaPRwire.com) – ULVAC, Inc. (hereinafter referred to as “ULVAC”) and Silicon Austria Labs GmbH (hereinafter referred to as “SAL”) join forces to collaborate on the development of plasma etching processes for high-volume manufacturing of thin-film lithium niobate (TFLN). The wide bandwidth, low loss, and high-power efficiency are […]










