TANAKA Establishes Bonding Technology for High-Density Semiconductor Mounting Using AuRoFUSE(TM) Preforms
TOKYO, Mar 11, 2024 – (JCN Newswire via SeaPRwire.com) – TANAKA Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo; CEO: Koichiro Tanaka), which develops industrial precious metals products as one of the core companies of TANAKA Precious Metals, announced today that it has established a gold particle bonding technology for high-density mounting of semiconductors using AuRoFUSE™ low-temperature […]